The term Internet of Packaging market to the integration of digital technology, such as sensors, RFID tags, and connectivity solutions, into packaging materials and products. This integration enables packaging to become smart, interactive, and connected, facilitating various functionalities such as real-time tracking, monitoring, authentication, and communication throughout the supply chain and product lifecycle. The IoP ecosystem encompasses a range of applications, including inventory management, product traceability, anti-counterfeiting measures, consumer engagement, and sustainability initiatives. By leveraging IoT-enabled packaging solutions, businesses can enhance operational efficiency, improve consumer experiences, and gain valuable insights into product performance and consumer behavior.
Top Key Players Covered in The Internet of Packaging Market:
Avery Dennison Corporation (US), Smartrac N.V. (Netherlands), BASF SE (Germany), Thin Film Electronics Asa (Norway), Stora Enso Oyj (Finland), Tetra Pak (Switzerland), Kezzler (Norway), Digimarc Corporation (US), Evrythng Limited (UK), Thinfilm Electronics Ab (Sweden),Scanbuy Inc. (US), Identiv Inc. (US), Smart glyph Ltd. (UK), E Ink Holdings Inc. (Taiwan), Paksense Inc. (US), Schreiner Group Gmbh Co. Kg (Germany), Smart Label Solutions (Spain), Gao Rfid Inc. (Canada)
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Key Chapter Will Be Provided In The Report
- Patent Analysis
- Regulatory Framework
- Technology Roadmap
- BCG Matrix
- Heat Map Analysis
- Price Trend Analysis
- Investment Analysis
- Company Profiling and Competitive Positioning
- Industry Value Chain Analysis
- Market Dynamics and Factors
- Porter’s Five Forces Analysis
- Pestle Analysis
- SWOT Analysis
Segmentation Analysis Of The Internet of Packaging Market
By Technology Deployed
- Sensor Tags
- Barcode QR code
- Radio Frequency Identification
- Low-Energy Bluetooth
- NFC Technologies
- Indicators
By Industry Verticals
- Personal and home care
- Health care
- Food Beverages
- Automotive
- Consumer Electronics
- Others
By Region
- North America (U.S., Canada, Mexico)
- Eastern Europe (Bulgaria, The Czech Republic, Hungary, Poland, Romania, Rest of Eastern Europe)
- Western Europe (Germany, UK, France, Netherlands, Italy, Russia, Spain, Rest of Western Europe)
- Asia Pacific (China, India, Japan, South Korea, Malaysia, Thailand, Vietnam, The Philippines, Australia, New Zealand, Rest of APAC)
- Middle East Africa (Turkey, Bahrain, Kuwait, Saudi Arabia, Qatar, UAE, Israel, South Africa)
- South America (Brazil, Argentina, Rest of SA)
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Key Industry Developments in the Internet of Packaging Market
- In May 2023, the Collaboration project shown multi-layer packaging can be separated and recycled on an industrial scale. A collaboration project involving the companies BASF, Krones, SÜDPACK, and TOMRA demonstrated that it is possible to separate PET/PE multi-layer packaging into its components and return them to the materials cycle as raw materials.
- In June 2021, establishing its emergence as a leading innovator in the solid-state micro battery market, Thinfilm announced that it would become Ensurge Micropower ASA. This new identity builds on the company's fundamental transformation and reflects its differentiation and rapid progress in technology, product, and manufacturing innovation.
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3) To understand the most affecting driving and restraining forces in the Internet of Packaging Market and its impact on the global market.
4) Learn about the Internet of Packaging Market strategies that leading respective organizations are adopting.
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